1. Support MP3 format, play automatically on the power, and update the red LED indicator when playing.

2. Support U disk (tested 32G), TF card (tested 16G) playback mode; Power on the default TF card mode, if the TF card does not

automatically jump to the U disk mode, and both devices have been installed, you can manually set the playback mode, please see

the key operation instructions for details.

3. The key can adjust up and down track switching, volume +-, pause/play, mode switching, please see the key operation

4. You can press the button to set the "single/Full song" cycle. By default, you can power on the full song cycle

1.Super sound quality, onboard 2W mono power amplifier (5V power supply up to 3W) directly connected to the speaker (recommended

with 4Ω 3W speaker), 3.5mm gold-plated headphone socket can be connected to headphones or external audio.

2. With MicroUSB power supply interface, the mobile power supply or USB charger can be used through the mobile phone data cable,

or 3.7V lithium battery, USB 5V power supply.

3. Support TF card (mobile phone storage card), U disk playback mode.

4. With horn terminal no need to weld, easy wiring.

5. Power supply range: 3.7~5V

PCB Techinecal Capacity
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Materials
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , TF, Polyimide, BT,PPO,
PPE, Hybrid, Partial hybrid, etc
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Surface Finish
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control

PCBA technical Capacity
Advantages
----Professional Surface-mounting and Through-hole soldering technology
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.
Components
Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
Testing
Flying Probe Test,X-ray Inspection AOI Test
SMT
Position accuracy: 20 um
Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
Max. component height: 25mm
Max. PCB size: 680×500mm
Min. PCB size: no limited
PCB thickness: 0.3 to 6mm
Wave-Solder
Max. PCB width: 450mm
Min. PCB width: no limited
Component height: Top 120mm/Bot 15mm
Sweat-Solder
Metal type: part, whole, inlay, sidestep
Metal material: Copper, Aluminum
Surface Finish: plating Au, plating sliver, plating Sn
Air bladder rate: less than 20%
Press-fit
Press range: 0-50KN
Max. PCB size: 800X600mm