PCB Techinecal Capacity
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Materials
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , TF, Polyimide, BT,PPO,
PPE, Hybrid, Partial hybrid, etc
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Surface Finish
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control

PCBA technical Capacity
Advantages
----Professional Surface-mounting and Through-hole soldering technology
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.
Components
Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
Testing
Flying Probe Test,X-ray Inspection AOI Test
SMT
Position accuracy: 20 um
Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
Max. component height: 25mm
Max. PCB size: 680×500mm
Min. PCB size: no limited
PCB thickness: 0.3 to 6mm
Wave-Solder
Max. PCB width: 450mm
Min. PCB width: no limited
Component height: Top 120mm/Bot 15mm
Sweat-Solder
Metal type: part, whole, inlay, sidestep
Metal material: Copper, Aluminum
Surface Finish: plating Au, plating sliver, plating Sn
Air bladder rate: less than 20%
Press-fit
Press range: 0-50KN
Max. PCB size: 800X600mm