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productIC package substrate for SIM CARD with E'tro-Ni/Au IC substrate
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Basic Info.Product Description

Basic Info.

Place of OriginChina
Brand NameN/A
Model NumberUO-21015A-A
Targrt productsPBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
Core materialMGC,Doosan,LG,Hitachi,Sumitomo,AMC
SR materialTaiyo,Hitachi,Sumitomo,SanEI
PatternTenting,MSAP,PSAP,ETS,SAP
SoldermaskPSR series
Surface FinishE'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au
Warranty1 year
SizeCustomized
MOQ20 strips
BrandNo brand
Portshenzhen
Selling Units:Single item
Single package size:20X20X20 cm
Single gross weight:0.100 kg

Product Description

Product Description
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Process Capability
Our Technology
• Fine pattern by MSAP(20/20um) and Tenting(30/30um)• Various Applicable Technical Option- Thin Core Technology- All type Surface Finish- SR Flatness Process, Build up / Via Filling Tech.- Tailless, Etch-back Process- Fine Pitch SOP process• High Quality and Reliability Substrate• High Speed Delivery : No need film, No outsourcing• Competitive Low Running Cost
W/B CSP Technology Roadmap
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FCCSP Technology Roadmap
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FPS(Fingerprint Sub.) Technology Roadmap
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OEM ODMWant to know more,please contact us freely!
Packing&Shipping
Lead time
Company Introduction
Zhuhai Fillgold Technology Co., Ltd. established in 2012, is a professional enterprise engaged in the research, development,sale and service of precision components for mobile communications; PCB heatsink; IC lead frame and IC Substrate,which widely applied to telecom, computer, industrial control, power, medical, automotive electronics and so on.Besides, we are making great efforts to develop new products to meet different requirements.We are located in Zhuhai city with convenient transportation access. Our company occupies an area of 3 0 0 0 0 square meters, is equipped with a variety of processes: stamping, precision grinding & polishing, CNC, chemical etching, plating and so on.Our tenet is multi-species, high quality, quick turn .Dedicated to strict quality control and thoughtful customer service, our experienced team is always available to discuss your requirements and ensure full customer satisfaction. In addition, we have obtained IATF 16949:2016; ISO9001:2015 and ISO14001:2015 certificates. Our products are selling well in all cities and provinces around China, and also exported to clients in such countries and regions as Europe. We also welcome other regions orders. Whether selecting a current product from our catalog or seeking engineering assistance for your application, Please talk to our customer service center about your sourcing requirements.
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Certifications
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FAQ
Q: Do you have any products in stock? A: Sorry, all of the products parts are customized design. Q: What could be the procedure if I need to make the prototypes? A:If you have drawings,such as Gerber,CAD.pls kindly send to us ,and tell us any your special requirements . Q: How to keep our product information and design file secret ? A: We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.
Contact Us
Send an E-mail to:support@bincial.com
IC package substrate for SIM CARD with E'tro-Ni/Au IC substrate
$8 ~ $9
Consumer electronics Industry Chain · printed circuit board · Package Substrate
global.BrandNo brand
avatar iconZhuhai avatar iconAuthenticated
100-499 EmployeesInformation Services and IT
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Support:021-61673695
Link:support@bincial.com
Addr.:Lane 1220, Yuqiao Road, Pudong New Area, Shanghai
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