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High Thermal Conductivity Multi-layer MCPCB 3W 3.0mm Four Layers Aluminum Core PCB
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Basic Info.Product Description
Basic Info.
| Base Material | Aluminum |
| Board Thickness | 3.0mm |
| Model Number | BAM22073 |
| Type | Four Layers Aluminum Core PCB |
| Place of Origin | Guangdong, China |
| Brand Name | Best Technology |
| Copper Thickness | 1oz |
| Min. Hole Size | 0.5mm |
| Min. Line Width | 0.15mm |
| Min. Line Spacing | 0.15mm |
| Surface Finishing | ENIG 1u'' |
| Board Size | 86mm*135mm |
| Product name | Four Layers Aluminum Core PCB |
| Type | Four Layers Aluminum Core PCB |
| MOQ | 1pcs |
| Layer | 1-32 Layers |
| Certificate | ISO9001/ISO16949/UL/RoHS |
| Packaging Details | 30pcs/box,1box/carton |
| Port | Yantian |
| Selling Units: | Single item |
| Single package size: | 60X31X31 cm |
| Single gross weight: | 0.090 kg |
Product Description
Item
Capabilities
Layer Count
1 - 10 Layers
Max Board Dimension
24*64"(610*625mm)
Min Board Thickness
0.3mm - 2.0mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz - 10oz
Min Line Width/Line Space
4/4mil (0.10/0.10mm)
Min Hole Diameter
10mil (0.25mm)
Min Punch Hole Dia
0.12" (3.0mm)
Min Hole Spacing
16mil (0.4mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
14mil (0.35mm)
Min Soldermask Bridge
8mil (0.20mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±3mil (0.075mm)
Outline Tolerance
CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio
10:01
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Capabilities
Layer Count
1 - 10 Layers
Max Board Dimension
24*64"(610*625mm)
Min Board Thickness
0.3mm - 2.0mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz - 10oz
Min Line Width/Line Space
4/4mil (0.10/0.10mm)
Min Hole Diameter
10mil (0.25mm)
Min Punch Hole Dia
0.12" (3.0mm)
Min Hole Spacing
16mil (0.4mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
14mil (0.35mm)
Min Soldermask Bridge
8mil (0.20mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±3mil (0.075mm)
Outline Tolerance
CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio
10:01
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm
FAQ
High Thermal Conductivity Multi-layer MCPCB 3W 3.0mm Four Layers Aluminum Core PCB
$21.5 ~ $26.6
Consumer electronics Industry Chain · printed circuit board · Metal Core PCB
Shenzhen 
Authenticated50-99 EmployeesWholesale/Retail/New Retail
