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productSyringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics
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Product Description

Product Description

Model NO.:Lead Free Solder Paste Condition:New Alloy:Lead Free Powder Size:Type 3: 25 to 45 Microns Powder Size 2:Type 4: 20 to 38 Microns Flux:No Clean Flux Alloy 2:Sac305 Sn96.5AG3.0cu0.5 Alloy 3:Sac0307 Sn99AG0.3cu0.7 Alloy 4:Sn42bi58 Low Temperature Certificate:RoHS Packing:Jar Packing 2:Syringe Shipping:Courier / Air Freight Shelf Life:6months Storage:0 to 10 Degree Celsius Application:SMT Soldering Application 2:SMD Soldering Transport Package:Foam Box Specification:100g to 1000g Trademark:XF Solder Origin:China HS Code:3810100000 Production Capacity:30tons/Month
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Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics
$39.89
Smart Device Industry Chain · Electronic Components · Circuit Board
Foshan Xi Feng Tin Products Co., Ltd.Foshan Xi Feng Tin Products Co., Ltd.avatar icon
avatar iconShenzhen avatar iconAuthenticated
Less than 50 EmployeesOther Manufacturing Industries

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bincialSyringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics
$39.89
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