Specifications:
Multi functional universal chip mounter H 806 plus
Advantage description:
- Multi camera CMDS high speed imaging technology based on FPGA, with multiple sensors taking pictures in full synchronization
- Real time image acquisitio with high frame rate and megapixel resolution
- Complete accurate visual identification of various standard and special-shaped parts
- The chip head adopts small volume, ultra quiet linear motor control technology
Specification
product feature
Application industry:
SMT electronic material patch, 3C,Aerospace, automotive electronics, home appliances, lighting, 3C consumer electronics, semiconductor
To realize multi-functional full-image high speed and high precision mounting, its high speed and high efficiency to cope with small components (01005, 0201-3216, micro transistor), at the same time can meet the range of medium and large components (SOP, QFP, BGA) multi-function mounting
localization rate of parts and components:95%
Product function
•01 Identification of various complex components
•02 High precision visual recognition system
•03 Real-time flying camera filming technology
•04 Simple and easy to operate interface
•05 Ultra quiet linear motor control technology
Product brief introduction
Product sample type:
Mounting
example
Precision device
Technical specifications:
•Positioning mode: flying vision + stage vision
•Number of Spindles :
•1 Gantry * 8 nozzles (Spacing 21mm)
•Pick and place accuracy: XY accuracy:
•±0 . 035mm
•Pick and place speed :CPH:18000
•Component Range:01005~40*35,H:15mm
SOP,QFP,BGA
etc,
•PCB
Dimension:
Minimum:length(50mm)*width(50mm), H:0~5mm
Maximum: standard
length(600mm)*
width(500mm), H:0~5mm
•Feeder Base: 8mm -120
pcs
•Power supply / Pressure:380/50Hz/0.5~0.7Mpa
•Rated Power:6.5KW
•Machine weight:1800Kg
•Dimension:1950(L)*1400(W)*1370(H);
adding the ground anchor (H): 1500mm
Product feature
•accurate
•stable
•efficient
•convenient and fast