One-StopOEMService

Ifdesired,wewillsource,organiseandmanageallaspectsofthePCBdesign,sothatyourproductmeetsallrequiredstandardsandisfullyoptimisedforeasyandcosteffectivemanufacturing.

Awelldesignedcircuitboardmeans:

·Areductioninproductionproblems

·Improvedqualitycontrol·Reducedcosts

·Reducedmanufacturingtimes

Weworktosupplysmallandlargebatchesofcompetitivelypricedprintedcircuitboardstoourcustomers.

WonderfulOne-stopPCBPCBAManufacturingincludesthefollowingaspects:
PCBDesign:ProvidingPCBdesignservices,includingcircuitdesign,layout,routing,andgeneratingPCBdesignfiles.
PCBManufacturing:Producinghigh-qualityPCBsusingadvancedPCBmanufacturingequipmentandprocesses,includingsingle-sided,double-sided,andmultilayerboards.
SurfaceTreatment:OfferingsurfacetreatmentoptionsforPCBs,suchasHASL(HotAirSolderLeveling),ENIG(ElectrolessNickelImmersionGold),OSP(OrganicSolderabilityPreservative),etc.,toprotectcircuitsandenhancesolderability.
ComponentProcurement:SourcingelectroniccomponentsanddevicesfromreliablesuppliersbasedonPCBAdesignrequirements.
PCBAAssembly:AssemblingelectroniccomponentsontoPCBs,completingtheentirePCBAassemblyprocess.
TestingandQualityControl:ImplementingrigoroustestingandqualitycontrolmeasurestoensuretheperformanceandreliabilityofPCBAproducts.
DeliveryandAfter-SalesSupport:DeliveringthefinishedPCBAproductstoclientsandprovidingafter-salessupporttoaddressanypotentialissues.
WonderfulOne-stopPCBPCBAManufacturingaimstoprovideclientswithconvenience,efficiency,andanintegratedapproachtocompletetheentirePCBandPCBAmanufacturingprocesswithasinglesupplier.Thishelpsreducecommunicationandcoordinationcostsandenhancesprojectexecutionefficiency.ChoosingWonderfulOne-stopPCBPCBAManufacturing,clientscanfocusonproductdevelopmentandmarketlaunchwhileensuringasmoothmanufacturingprocessandobtaininghigh-quality,reliable,andcost-effectivePCBAproducts.

ItcanbeachallengetofindtheoptimalsupplierforPCBs–meetingeachandallcustomers’expectationsandrequirementsonprice,quality,leadtimes,value-addedservices,anddelivery.WonderfulPCBisconfidentthatwemeeteveryexpectationforeachPCB.

Ouradvantage
MaterialTechnology
OurProduction
GeneralProduction
Regular/Special
1.Our(TG170)FR4:
highqualitymaterials,excellentheatresistance,won'tdistortbreakinhightemperature,nofoaming,noburning,good
performanceinelectricalcharge,impactresistance,humidity-resistance

2.OurFR4
goodperformanceinelectricalcharge,impactresistance,humidity-resistance

3.OurCEM
no-burr

4.OurRogers
Goodperformanceinhighfrequency

5.OurAluminum
Excellentheatdispersion
1.GeneralFR4
Highheatwork

2.GeneralCEM
Expandanddeformindampconditions
Factory
Wehaveautomaticproductionline.TheautomaticproductionlineimprovestheprecisionandefficiencyofPCBproducing,itmakes
surfacebrighter,cleanerandmoresmooth,andithelpsreducethecost.
Artificialproductionline
Blind/buriedviaboard,HighDensityInterconnect(1+1,N+1)
ApplicationofHDItechnologyreducingthethicknessandthevolumeofPCBboards,increasingthedensityof3-Dwiringdesign.
Difficultmanufacturer,highcost
Impedance
Goodperformanceinreliabilityandstabilityofsignalsendingandreceiving
Highcost
SurfaceTechnics
1.IMG:smoothsurface,goodadhesion,nooxidationunderlongusing
2.goldplating(thickgold:1-50U"):goodwear-resistance
3.HASL:betterprice,noteasyoxidation,easytowelding,smoothsurface
4.HAL:betterprice,noteasyoxidation,easytowelding
1.IMG:highprice
2.Goldplating(thickgold):highprice
3.HAL:surfaceisnotflat,notsuitableforBAGpackaging
CopperVia/Surface(20-25UM,0.5-60Z)
Laserholing:Min0.1MM,Mechanicalholing:Min0.2MM
Hardtoreach0.1MM
Multilayerboard(4-20L),BGA(CPU)
BGA:highdensity,highperformance,multifunctional,increasethermalreliability,goodperformanceinelectroheatproperty,MIN
width/space:3/3MIL

Multilayerboard:strongmicroporous,highreliability
Difficultmanufacturer,highcost
Test
Toassurequality,avoidwastingafterinstallingandscraping,savecost,savethetimeofrework
Careless