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Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
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Product Description
Product Description
Model NO.:FD-300QA Automatic Grade:Semiautomatic Cylindrical Grinder Type:Surface Grinding Machine Precision:High Precision Certification:ISO 9001 Condition:New Power Source:Electricity Disc(Wheel) Type:Grinding Disc Variable Speed:with Variable Speed Application:Semiconductor Material Material:Metal and Non-Metal Working Style:Reduction Disc Diameter:Φ300 Service:Oversea Setup & After-Sale Avalaible Class:Single Plate Process Station:3 Pressure Source:Pneumatic or Weight Block Plate Material:Metal & Non-Metal Abrasive:Slurry Weight:1000kg Transport Package:Wood Crate Trademark:PONDA Origin:China Production Capacity:500 Unit/Year
Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
$7977.96 ~ $19944.9
Other Devices · Basic Manufacturing Equipment · Machine Tools
Shenzhen 
AuthenticatedLess than 50 EmployeesOther Manufacturing Industries
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