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productPCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board
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Product Description

Product Description

Model NO.:FL006 Processing Technology:Electrolytic Foil Base Material:Copper Insulation Materials:Metal Composite Materials Brand:FL Board Material:Fr-4 (Tg 135 ) Board Thickness:1.6 mm Copper Thickness:3 Oz (35um) Surface Treatment:HASL Lead Free / Enig Solder Mask:Blue Silk Screen:White Flying Probe Test:Yes Product Name:12 Layer High Density Interconnect PCB HDI PCB MOQ:1PCS Transport Package:Vacuum Packing Specification:Certificates: UL, ROHS Trademark:FL Origin:China HS Code:8534009000 Production Capacity:20000 Square Meter/Mon
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PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board
$0.5 ~ $6.63
Smart Device Industry Chain · Electronic Components · Circuit Board
Fastline Circuits Co., LimitedFastline Circuits Co., Limitedavatar icon
avatar iconShanghai avatar iconAuthenticated
Less than 50 EmployeesInternet/e-commerce

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