Package Innovation Enginee
发布时间:2023年12月4日 15:14
Author电芯元智
Principal Process Development Engineer
Work in a global team supporting research & development of IGBT/SIC/GaN devices.
Be familiar with Power module assembly process, especially in transfer mold, potting mold , adhesion promotion, coating process.
Response for above process and related material/machine qualification.
Support customer design-in / de-bugging characterization requests.
Built competences up to expert level on statistics, Semiconductor processes, communication, English language, reporting, and working in projects, BCAM, yield and data analysis tools.
Process engineering within development and sustaining projects to eliminate technology related failures.
Assure quality in project management, design and development activities.
Identify and address technology gaps and drive quality improvements activities.
Drive decisions for the disposition of critical nonconforming product.
Manage and lead problem solving activities arising from product failures, customer complaints and quality incidents.
Support customer requests for quality information.
Ensure compliance with quality procedures and applicable quality standards.
Bachelor or Master degree in Material, Engineering, Mechanical.
At least 5 years of experience in Semiconductors.
In depth knowledge of power semiconductor devices, ideally IGBT/SIC Power Module.
Experience with the process development of FOL of power module.
Be familiar with DOE/6sigma/DFX/DFMEA/PFMEA
Have customer orientation and a quality mindset.
Analytical Skills and ability to apply pragmatic approaches.
Leadership skills and experience.
Target driven, shows initiative and have an entrepreneurial attitude.
A wide knowledge of semiconductor manufacturing processes, testing & measurement techniques.
Excellent communication skills and be confident to talk with overseas sites & customers.
Ability to communicate complex concepts and requirements clearly and to influence stakeholders at all levels.
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