The main advantages are protecting IP, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies.

Introduced in the latest updates to Simcenter Flotherm software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate a model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.

.Today’s electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, or demanding processing requirements.

As a result, the need for more detailed thermal models to help solve thermal management design tasks is growing. Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.

For more: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/