The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing or a cold-plate.

It is expected to be used with a thermal interface pad to accommodate tolerance between PCB and heatsink surface.

SSO10T dissipating 5W in 85°C ambient with various thermal interface thickness and material

“SSO10T is based on the industry standard SSO8,” it said. “However, due to its top-side cooling, the SSO10 offers more than 20% and up to 50% higher performance than the standard SSO8 – depending on the thermal interface material used and the its thickness.”

As a thermal patch and thermal vias are no longer required on the PCB, the company predicts that some designs will be able to use simple double-sided PCBs.

So far, the company has released four mosfets in the package, all 40V n-channel: