Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices
Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer
We
a wide range of semiconductor bonding tools from Die Attach to Wire Bonding. This includes Die
Attach & Vacuum Pick Up Tools, Flip Chip Tools and Semiconductor Wire Bonding Capillaries & Wedges.We offer standard designs as well as custom designs for customer specific packaging requirements and
challenges.copper and silver alloy wire bonding.

Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)