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Product Description
Product Description
commodity classification System on Chip SoC
brand XILINX
package BGA
architecture MCU,FPGA
flash size -
core processor Dual ARMCortex-A9MPCore with CoreSight
RAM size 256KB
peripherals DMA
connection capability CANbus,EBI/EMI, Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USBOTG
speed 800MHz
main attributes Kintex-7FPGA, 350K logic cell
operating temperature -40℃~100℃（TJ）
I/OS 130
Basic product number XC7Z045
HTSUS 8542.39.0001
ECCN 3A991D
REACH status Non-REACH products
Moisture Sensitivity Level (MSL) 4 (72 hours)
RoHS Status Comply with ROHS3 specifications
brand XILINX
package BGA
architecture MCU,FPGA
flash size -
core processor Dual ARMCortex-A9MPCore with CoreSight
RAM size 256KB
peripherals DMA
connection capability CANbus,EBI/EMI, Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USBOTG
speed 800MHz
main attributes Kintex-7FPGA, 350K logic cell
operating temperature -40℃~100℃（TJ）
I/OS 130
Basic product number XC7Z045
HTSUS 8542.39.0001
ECCN 3A991D
REACH status Non-REACH products
Moisture Sensitivity Level (MSL) 4 (72 hours)
RoHS Status Comply with ROHS3 specifications
Component XC7Z045-2FFG676I
$60.31 ~ $63
Smart Device Industry Chain · Chip · SOC
Shanghai 
AuthenticatedLess than 50 EmployeesInformation Services and IT
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