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德邦科技:公司材料广泛应用于华为、小米等智能终端领域的企业上
Posted Time: 2024 November 2 15:31
116
electronics workshop
新京报贝壳财经讯 11月1日,德邦科技在回应投资者询问时表示,公司智能终端封装材料广泛应用于国内外知名品牌,包括苹果公司、华为公司、小米科技等智能终端领域的全球龙头企业。公司光敏树脂材料已批量应用于小米15最新屏幕工艺“LIPO立体屏幕封装技术”。
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